Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

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Brand Name :XCE
Model Number :XCER-1
Certification :CE,ROHS, FCC,ISO9008
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Board thickness :0.2mm
Copper THK :1OZ
Board size :15*9cm
Surface finish :Immersion gold
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Multi-layer HF Rogers PCB Sufficient Material In Automotive Device Application

Specification

  • 2 layer
  • Green solder mask,
  • white silk screen
  • Model:XCER
  • Size: 15*9cm
  • Location: Shenzhen
  • Board thickness: 0.2mm
  • Copper thickness: 1OZ

Laminates:

  • High Tg, BT resins
  • Low Dk, Low Df Formulations
  • High Strength, Low CTE selections
  • Polyimide/Kapton
  • Multi-function FR-4
  • Min Cladding 1 oz
  • Max Cladding 2 oz
  • Min Thickness .03mm (.0012)

Parameter

Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Advantage:

Newest PCB machine and top technology,professional engineer team

Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.

Accept utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.

Utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.

China Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB for sale

Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

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