Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

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Brand Name :XCE
Model Number :XCE WTO
Certification :CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :MOQ 1 Piece
Price :Negotiation
Payment Terms :T/T, Western Union
Supply Ability :1000000 pieces per week
Delivery Time :5-10 working days
Packaging Details :1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color :Green
Material :Rogers Material
Layer :6 L
Board Size :19*18cm
Copper Thinknes :1 oz
Min Line Width :4 mil
Min Line Space :4mil
Surface Finish :Gold Neckle Finger Plating
Name :Rogers pcb
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RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

Products Details

Raw Material Rogers
Layer Count 6
Board Thickness 0.5 mm
Copper Thickness 0.5 oz
Surface Finish Gold Nickel Finger Plating
Solder Mask Blue
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 560*400mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PCB Capability

Layer 1-30L
Material CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
Board Thinckness 0.2-6mm
Max Finish Size 800*508mm
Min. Drill Hole Size 0.25mm
Min. Line Width 0.075mm(3mil)
Min. Line Spacing 0.075mm(3mil)
Surface finish HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
Copper thickness 0.5-4.0 Oz
Solder mask color green/black/white/red/blue/yellow
Inner packing Vacuum packing, Plastic Bag
Outer packing standard carton packing
Hole tolerance PTH:±0.076,NTPH:±0.05
Certificate ISO9001,SGS
Profiling punching Routing,V-CUT,Beveling

Parameter:


Rogers 4003 C Pcb With 3.38 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 4350 B pcb With 3.5 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz , 2 oz ,3 oz .
Rogers 5880 Pcb With 2.2 ER . There are 0.127 mm ,0.254 mm ,0.762 mm 0.508 mm 1.6 mm board thinckness with 1 oz,2 oz, 3 oz

Rogers 3003 Pcb With 3 ER . There are 0.127mm,0.508mm 0.762mm 1.6 mm 3 mm Board Thinckness with 1 oz ,2 oz , 3 oz .

Rogers 3010 Pcb With 10.2 ER . There are 0.635 mm Thinckness Board with 1 oz , 2 oz ,3 oz .



PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl






Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

China RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway for sale

RF Rogers Material ER 3.38 0.5 mm 0.5 OZ Pcb Assembly With Silkscreen Peeelable Mask For Wilreless Gateway

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