Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Multilayer Rogers Rt / Duroid RF PCB Board For Naval UAVS System On Submarine

Multilayer Rogers Rt / Duroid RF PCB Board For Naval UAVS System On Submarine

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Brand Name :XCE
Model Number :XCE GR
Certification :CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :MOQ 1 Piece
Price :Negotiation
Payment Terms :T/T, Western Union
Supply Ability :1000000 pieces per week
Delivery Time :5-10 working days
Packaging Details :1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color :Green
Material :Rogers Mixed Material
Layer :Multilayer
Board Size :48*35cm
Copper Thinknes :1 oz
Min Line Width :4 mil
Min Line Space :4mil
Surface Finish :Immersion Gold Over Nickel, Carbon Print
Drill :Blind & Buried Vias
Name :Rogers Mixed Fr4 Pcb
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Multilayer Rogers Rt/ Duroid Material Pcb Board For Naval UAVS System On Submarine

Products Details

Raw Material Rogers
Layer Count Multilayer
Board Thickness 0.8mm
Copper Thickness 1 oz
Surface Finish Immersion Gold Over Nickle
Solder Mask Green
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 480*350 mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PCB Capability

Layer 1-30L
Material CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
Board Thinckness 0.2-6mm
Max Finish Size 450*508mm
Min. Drill Hole Size 0.25mm
Min. Line Width 0.075mm(3mil)
Min. Line Spacing 0.075mm(3mil)
Surface finish HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
Copper thickness 0.5-4.0 Oz
Solder mask color green/black/white/red/blue/yellow
Inner packing Vacuum packing, Plastic Bag
Outer packing standard carton packing
Hole tolerance PTH:±0.076,NTPH:±0.05
Certificate ISO9001,SGS
Profiling punching Routing,V-CUT,Beveling

PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl


Compared Data :

Model ER Tanδ@ 1GHz Cter (ppm/℃)

CTE (X,Y)

(ppm/℃)

FR4 Normal 4.6 0.030 17
FR4 PCL370(FR4-HTG) 4.3 0.0015 51 17
FR4 117 (FR4-HTG) 4.4 0.013 17
Park Neclo N4000-6-FC BC (FR4-HTG) 4.1 0.0015 16




Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

China Multilayer Rogers Rt / Duroid RF PCB Board For Naval UAVS System On Submarine for sale

Multilayer Rogers Rt / Duroid RF PCB Board For Naval UAVS System On Submarine

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