Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Electronic High TG180 FR4 Multilayer PCB Double Sided Circuit Boards
Specification:
| Technology | Materials |
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| PCB thickness | Final copper |
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| Conductor track widths | Minimum drilling diameter |
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| Contour production | Solder masks |
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| Surfaces | Additional printing |
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| Layer | 12-26 |
| Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness | 0.21mm to 7.0mm |
| Copper thickness | 0.5 OZ to 6 oz |
| Size | Max. Board Size: 580mm×1100mm |
| Min. Drilled Hole Size: 0.2 mm (8 mil) | |
| Min. Line Width: 4mil (0.1mm) | |
| Min. Line Spacing: 4mil (0.1mm) | |
| Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating |
| Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
| Tolerance | Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
