Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Technical Multilayer PCB Boards With Prototype Design Service
Specification:
| Model | XCEM | Origin | Shenzhen,China |
| Min line space | 3mil | Min line width | 3mil |
| Size | 9*9cm | Copper foil | 35UM |
| Layer | 6 | Material | Rogers |
Parameter:
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Layer |
6 |
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Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
|
Board thickness |
0.21mm to 7.0mm |
|
Copper thickness |
0.5 OZ to 6 oz |
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Size |
Max. Board Size: 580mm×1100mm |
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Min. Drilled Hole Size: 0.2 mm (8 mil) |
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Min. Line Width: 4mil (0.1mm) |
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Min. Line Spacing: 4mil (0.1mm) |
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Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating |
|
Solder Mask Color |
Green/Yellow/Black/White/Red/Blue |
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Tolerance |
Shape tolerance: ±0.13 |
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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Certificate |
UL, ISO 9001, ISO 14001 |
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Special requirements |
Buried and blind vias+controlled impedance +BGA |
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Profiling |
Punching, Routing, V-CUT, Beveling |
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:
High-voltage E-test
Flying probe machine
Digital computer metallographic microscope
Copper thickness tester
Solderability detecting machine
Photoelectricity balance
X-ray gold thickness tester
Backlighting tester
Automatic optical inspector