Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Turnkey Solar Inverter FR4 PCB Circuit Board With Design Service
Specification:
| Layers:2 | Material:FR4 |
| Board thickness:1.2MM | Copper thickness:1.5OZ |
| Min hole size:8mil | Min line space:8mil |
| Min line width:8mil | Surface:Lead free |
| Solder mask color: green | Certificate:Iso9001,SGS |
Parameter:
| Copper thickness in hole | >25.0 um (>1mil) |
|
Size | Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) | |
| Min. Line Width: 3mil (0.075mm) | |
| Min. Line Spacing: 3mil (0.075mm) | |
|
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
| Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
| Any other special material please feel free to let us know | |
Description:
Standard products(4, 6 layers), FR4, photo-sensitive soldermask
Special types (thick copper, thin core, hard gold, etc)
High layer count(8-40 layers)
High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…
Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4
Back panels: thick PCBs, press-fit technology, large size PCBs.
