Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Power Bank 2 Layer FR4 PCB Circuit Boards For Electronic Products
Quick Detail:
| Material: FR4 | Number of layer: 2 |
| Model: XCEF | Brand: XCE |
| Name: FR4 PCB | Origin: China |
Advantages:
1) We have professional research team.
2) No MOQ,small order are aslo welcome,From Prototype to Mass production.
3) All products are 100% tested working before sent to you.
4) One stop PCB solution
5) We have professional sales team, so please do not hesitate to contact us if you have any question
Description
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Xinchenger Electronics co.,Ltd established in 2009,we have commited ourselves to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production.
we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.
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PCB CAPABILITIES LIST |
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Product Features |
Standard |
Advanced |
Micro Electronics |
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PC Board Attributes |
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Min Layer count |
1 |
1 |
1 |
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Max Layer Count |
24 |
26+ |
26+ |
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Min Board Thickness |
.010" |
.004" |
.004" |
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Max Board Thickness |
.200" |
.200" + |
.200" + |
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Min Core Thickness |
.002" |
.002" |
.002" |
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Min Dielectric |
.002" |
.001" |
.001" |
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Min. Starting Copper Foil Weight |
9 micron |
3 micron |
3 micron |
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Max. Finished Copper Thickness (O/L) |
6 oz |
> 6 oz |
.0015" |
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Max. Finished Copper Thickness (I/L) |
4 oz |
> 4 oz |
.001" |
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Maximum Panel Size |
21" x 29" |
21" x 29" |
12" x 18" |
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Minimum Panel Size |
12" x 18" |
12" x 18" |
8" x 8" |
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Smallest Mech Drill Diameter |
.0059" |
.004" |
.004" |
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Smallest Laser Drill Diameter |
.0030" / .0080" |
.0025" / .0100" |
.0025" / .0100" |