Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Frequency FR4 Sensor PCB Boards 5.8GHZ For Induction Lamp
Quick Detail:
Model: XCEF
Brand: XCE
Name: Sensor PCB
Origin: China
Material: FR4
Number of layer: 2
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
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PCB CAPABILITIES LIST |
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Product Features |
Standard |
Advanced |
Micro Electronics |
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PC Board Attributes |
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Min Layer count |
1 |
1 |
1 |
|
Max Layer Count |
24 |
26+ |
26+ |
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Min Board Thickness |
.010" |
.004" |
.004" |
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Max Board Thickness |
.200" |
.200" + |
.200" + |
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Min Core Thickness |
.002" |
.002" |
.002" |
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Min Dielectric |
.002" |
.001" |
.001" |
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Min. Starting Copper Foil Weight |
9 micron |
3 micron |
3 micron |
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Max. Finished Copper Thickness (O/L) |
6 oz |
> 6 oz |
.0015" |
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Max. Finished Copper Thickness (I/L) |
4 oz |
> 4 oz |
.001" |
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Maximum Panel Size |
21" x 29" |
21" x 29" |
12" x 18" |
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Minimum Panel Size |
12" x 18" |
12" x 18" |
8" x 8" |
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Smallest Mech Drill Diameter |
.0059" |
.004" |
.004" |
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Smallest Laser Drill Diameter |
.0030" / .0080" |
.0025" / .0100" |
.0025" / .0100" |
Description
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantages:
1) We have professional research team.
2) No MOQ,small order are aslo welcome,From Prototype to Mass production.
3) All products are 100% tested working before sent to you.
4) One stop PCB solution
5) We have professional sales team, so please do not hesitate to contact us if you have any question