Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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FR4 PCB Multilayer Layer Mixed Compression with Rogers4350B High Frequency Circuit Board
Specification:
| Borad size:8*6cm | Type:fr4 high frequency |
| Board thickness:1.2MM | Model:XCEF-2 |
| Surface finish:HASL lead free | Solder mask and silk screen:Green/white |
Description:
We continuously enaged in researching special and high precision printed circuit boards with the strong
production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,
multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.
we have accumulated abandunt experiences in the line of high frequency microwave business for which
widely apply to power divider,
combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our
company's sufficient stocks of hi-frequency pcb materials such as Rogers,
TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,
Electronics
Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen
on helping customers shorten the period of production development
and 24 hours of sample service is available.
Advantage:
Have 6 years high frequency pcb production experience.
Have sufficient material raw in stock.
Newest machine and top technology
Application
High technology fields such as Telecom: transmitter. Receiver. Oscillator. Antenna. Satellite receiver
