Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Precision FR4 PCB High Difficult Customized Service Printed Circuit Board
Specification:
high difficult pcb such as min line space and width 2mil
Machinable maximum thickness to diameter ratio: 10:1
Hole position deviation: ±0.05mm/ 2mil
Profile tolerance: ±0.15mm/ 6mil
Min S/M bridge: 0.1mm/ 4mil
Twist and bent: ≤1.5%
Peel strength: 1.5N/mm
Solder mask abrasion: ＞4H
Parameter:
| Layer | 1-26(layer) |
| Max Board size | 2layer :600mm*1200mm(24" * 47)" |
| Multilayer :600mm*600mm(24" * 24)" | |
| Copper thick | 0.5OZ-8OZ/18um-280um |
| Min Board Thickness | single:0.1mm—6.0mm/4mil-240mil |
| 2 layer:0.2mm--6.0mm/8mil-240mil | |
| 4 layer: 0.4mm-6.0mm /16mil-240mil | |
| 6 layer: 0.8mm-6.0mm/32mil-240mil | |
| 8 layer: 1.0mm-6.0mm/40mil-240mil | |
| 10 layer: 1.5mm-6.0mm/60mil-240mil | |
| Min line width( sample) | 0.075mm/3mil |
| Min space( sample) | 0.075mm/ 3mil |
| Min hole size | 0.2mm/8mil |
| Machinable maximum thickness to diameter ratio | 10:1 |
| Impedance control | +/-10% |
Quality control
Application:
Products are applied to a wide range of High-tech industries such as: Medical instrumentation,wireless and wired telecommunication,computer application, lighting, game machine, industrial control, Power amplifier automobile and high-end consumer electronics, ect.