Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
Add to Cart
2 Layer High Frequency Materials PCB For Gate Access System
Specification:
Board size: 8*8 cm
Layer: 2
Model: XCEH
Board thickness: 1.2mm
Copper foil: 35UM
Material: taconic
Description:
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
Parameter:
|
PRODUCT’S DETAILS |
|
|
Raw Material |
taconic |
|
Layer Count |
2-Layer |
|
Board Thickness |
1.2mm |
|
Copper Thickness |
35UM |
|
Surface Finish |
OSP |
|
Solder Mask |
grey |
|
Silkscreen |
White |
|
Min. Trace Width/Spacing |
0.075/0.075mm |
|
Min. Hole Size |
0.25mm |
|
Hole Wall Copper Thickness |
≥20μm |
|
Measurement |
300×400mm |
|
Packaging |
Inner: Vacuum-packed in soft plastic bales |
|
Application |
Communication,automobile,cell,computer,medical |
|
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
|
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
|
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |