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High Frequency PCB For Wireless And Wired Telecommunications And Aerospace Industries
Specification:
Board size: 4*6 cm
Layer: 2
Model: XCEH
Board thickness: 0.2mm
Copper foil: 35UM
Material: Rogers
Description:
High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.
Parameter:
Min board thickness | 2 layer 0.2mm | ||||||||
4 layer 0.4mm | |||||||||
6 layer 0.6mm | |||||||||
8 layer 0.8mm | |||||||||
10 layer 1.0mm | |||||||||
Max panel size | 508*610mm | ||||||||
Board thickness tolerance T≥0.8mm±8%,T<0.8mm±5% | |||||||||
Wall hole copper thickness | >0.025mm(1mil) | ||||||||
Finished hole | 0.2mm-6.3mm | ||||||||
Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
Min bonding pad space | 0.1mm(4mil) | ||||||||
PTH aperture tolerance | ±0.075mm(3mil) |
NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
Hole site deviation | ±0.05mm(2mil) | ||||||||
Profile tolerance | ±0.10mm(4mil) | ||||||||
Board bend&warp | ≤0.7% | ||||||||
Insulation resistance | >1012Ωnormal | ||||||||
Through-hole resistance | <300Ωnormal |