Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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OEM Printed Circuit Board PCB Manufacturing Process 4 Layer 1.2mm Board Thickness

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Brand Name :XCE
Model Number :XCET
Certification :CE,ROHS, FCC,ISO9008,SGS
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Permittivity :10
Base material :CER-10
Surface finish :Immersion Silver
Layer of number :4
Board size :28*12cm
Copper THK :1OZ
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Permittivity ER=10 Taconic PCB CER-10 Based On Military Grade Material

Specification:

Board size 28*12cm Board thickness 1.2mm
Layer 4 Base material taconic
Min line space 5mil Min line width 5mil
Brand XCET Origin China


Parameter

CER-10 is a ceramic loaded DK 10 laminate, based on a woven glass reinforcement. CER-10 is a result of Taconic’s expertise in both ceramic fill technology and in coated PTFE fabrics.
CER-10 exhibits exceptional interlaminar bond strength and solder resistance. CER-10’s proprietary composition results in low moisture absorption and uniform electrical properties.
CER-10’s woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. This DK 10 laminate exhibits low Z-axis expansion (CTE 46 ppm/°C), allowing for plated-through-hole reliability in extreme thermal environments.
CER-10 laminates can be sheared, drilled, milled and plated, using standard methods for PTFE/woven fiber-glass materials.

Application:

  • High Power Amplifier, TMA, TMB, LNA: for GSM, UMTS, 3G, PCS, PCN, WCDMA, TD-SCDMA, EDGE, CDMA2000
  • Repeater
  • Phase Shifter
  • Antenna
  • Filters and Coupler
  • Passive Components

Advantage:

  • Exceptional Interlaminar Bond
  • Low Moisture Absorption
  • Enhanced Dimensional Stability
  • Low Z-Axis Expansion
  • Stable Dk Over Frequency
  • Circuit Miniturization
  • Increased Flexural Strength

Taconic Model THK ER

TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
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