Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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DK = 3.38 Rogers 4003C RF / Microwave PCB Circuit Boards Maker
Technology:
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Material |
FR4(standard) |
Isola |
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FR4(Hi-Tg) |
Isola / Nanya / ITEQ |
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Rogers |
RO4003 /4350 /3010 /RT Duroid 5880 / 5870 |
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Arlon |
Diclad 25N / 25FR / 870 / 880 |
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Taconic |
TLY / TLC / RF35 / RF30 |
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GETEK |
RG200D / ML200D |
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Aluminum PCBs |
Di-electric materials : FR4 / Bergquist / Rogers / Thermagon |
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Copper weight |
1 ~ 5 oz internal & external layers |
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Drilling |
Min. Drilled Hole Size |
10 mil ( 6 ~ 8 mil finished) |
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Annular Ring |
5 mil(normal) / 4 mil (for Laser vias) |
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Registration |
± 3 mil |
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Max. Aspect Ratio |
10 :1 |
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Hole Size Tolerance |
+/- 3 mils (PTH) ; +/- 2 mils (N-PTH) |
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Hole Roughness |
< 0.8 mil |
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Min. Cu Plating in Holes |
> 0.8mil, Ave. 1 mil |
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Laser drill |
available |
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Image Transfer |
Min. Trace and space |
4 / 4 mil |
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SMT / BGA.Pitch |
10 mils for SMT / 30 mils for BGA |
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Trace/space Tolerance |
± 20% (or +/- 10% per IPC class 3) |
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Solder Mask |
LPI Solder Mask |
Green(glossy or matte), Blue, Red, Black, Yellow |
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Via Plugging |
min. 80% filled |
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Solder Mask ink |
Taiyo & Tamura |
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Registration |
± 2 mil |
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Min Solder Dam |
2.5 mil |
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Thickness |
0.5 ~1.5 mil |
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Silkscreen |
White, Yellow, Black |
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Min. silkscreen width |
8 mil |
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CNC Dimension |
± 5 mil |
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Punch Dimension |
± 4 mil |
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Blind Vias / Buried Vias |
Yes |
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VIP (Via in Pad) |
Yes (Non-conductive epoxy resin-filled or Cu filled) |
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Impedance control |
|
± 10% |
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Surface Finish |
HASL |
200 ~ 500 μ" |
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Pb free HASL |
100 ~ 500 μ" |
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Immersion Gold |
1 ~ 5 μ" |
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Immersion Silver |
6 ~ 12 μ" |
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Immersion Tin |
25 ~ 40 μ" |
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Electolytic Gold |
Yes |
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Gold Finger Plating |
5 ~ 40 μ" |
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OSP(Entek) |
yes |
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Solder Mask Coating Method |
Silkscreen printing (Double or triple coatings available) |
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Carbon Ink |
20 Ω |
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Peelable mask |
Thickness = 0.3 mm |
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Pumice Pre-treatment |
Available |
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