Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Wireless Infrastructure Material Isola PCB Custom Printed Circuit Boards Green Solder Mask
Specification:
Application:
Automotive,Backplanes,RF / Microwave,High End Computing
Signal Integrity,Medical,Military,Mobile Devices / Wireless Handsets
Railway,Servers,Switches/Routers,Thermal Management,Wireless Infrastructure
Parameter
|
o. |
Item |
Spec |
|
1 |
Layers |
6 layers |
|
2 |
Max working panel area |
457 x 610 mm |
|
3 |
Min board thickness |
4 layer: 0.40mm |
|
6 layer: 0.80mm |
||
|
8 layer: 1.00mm |
||
|
10 layer: 1.20mm |
||
|
4 |
Min trace width |
0.10mm |
|
5 |
Min spacing |
0.10mm |
|
6 |
Min hole diameter |
0.20mm |
|
7 |
Min Copper thickness in hole |
0.020mm |
|
8 |
PTH size tolerance |
±0.05mm |
|
9 |
NPTH size tolerance |
±0.025mm |
|
10 |
Hole position tolerance |
±0.05mm |
|
11 |
Dimension tolerance |
±0.1mm |
|
12 |
Min solder mask dam |
0.08mm |
|
13 |
Insulation resistance |
1E+12Ω (normal condition) |
|
14 |
Max Board thickness/Hole size Rate |
'10:01 |
|
15 |
Thermal shock endurance |
288 3 times in 10sec |
|
16 |
Max Board twist and wrap |
≤0.7% |
|
17 |
High Vlotage endurance |
1.3KV/mm |
|
18 |
Copper foil peel off endurance |
1.4N/mm |
|
19 |
Hardness of resist ink |
≥6H |
|
20 |
Flame resistance |
94V-0 |
|
21 |
Impedance control |
±5% |
Advantage:
Have stock of Scarcity of material,short time of incoming material,save costing for you