Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

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Brand Name :XCE
Model Number :XCEH
Certification :CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Material :FR4
Layer :8
Color :green
Min line space :8mil
Min line width :8mil
Copper thickness :1OZ
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8 Layer TG130 High TG PCB LED Copper Based Metal Core Circuit Board


Specification:

Size: 5*3 cmBoard THK: 1.2MM
Copper THK: 1OZOrigin: China
Model: XCEHBrand: XCE



Description:

Tg is Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated
tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.
High TG materials have better mechanical strength, dimension stability, adhesiveness, moisture absorption, thermal decomposition,
and thermal expansion than normal TG pcbs.
High Tg material (TG170) is also popular in LED lighitng industry, because heat dissipation of LED is higher than normal electronic
components, however same structure of FR4 board is much cheaper than that of metral core pcbs, like aluminum board.

Parameter:

 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness>2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/
Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Outline Tolerance

≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm

≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm






























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