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Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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4 Layer Printed Circuit Boards High TG PCB High Thermal Conductivity , 1OZ Copper

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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China 4 Layer Printed Circuit Boards High TG PCB High Thermal Conductivity , 1OZ Copper wholesale
  • China 4 Layer Printed Circuit Boards High TG PCB High Thermal Conductivity , 1OZ Copper wholesale
  • China 4 Layer Printed Circuit Boards High TG PCB High Thermal Conductivity , 1OZ Copper wholesale

4 Layer Printed Circuit Boards High TG PCB High Thermal Conductivity , 1OZ Copper
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Brand Name :XCE
Model Number :XCEH
Certification :CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Material :FR4 High TG PCB
Layer :4
Color :GREEN
Min line space :10mil
Min line width :10mil
Copper thickness :1OZ
Size :6*4 cm
Board THK :1.6MM
Panel :3*4
Surface finish :Immersion gold
Model :XCEH
Brand :XCE
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4 Layer Circuit Boards High TG PCB High Thermal Conductivity Specification

Testing Procedures For PCB Board:

We perform multiple quality assuring procedures before shipping out any PCB board.

These include:

* Visual Inspection

* Flying probe

* Impedance control

* Solder-ability detection

* Digital metallograghic microscope

* AOI (Automated Optical Inspection)

Quotation Requirement :

Following specifications are needed for quotation:

a) Base material

b) Board thickness

c) Copper thickness

d) Surface treatment

e) color of solder mask and silkscreen

f) Quantity

Our Manufacturing Capability

Item Capability Item Capability
Layer 1-12L Min.Finished Hole 0.1mm
Board Thickness 0.3-3.2mm PTH/NPTH Tolerance ±0.076mm ±0.05mm
Laminate Type FR-4 Halogen free High TG Hole Cu.Thickness ≥25μm
Laminate Brand Shengyi,Nanya Min.Dielectrical Thickness 0.0635mm
CuFoil Thickness 1/2 - 4oz Layer Misregistration ±0.076mm
Peel Strength ≥12.3 N/cm Min.Solder Mask Dam 0.05mm
Max.Panel Size 600mm * 700mm Min.Legend Width 0.10mm
Min.Line Width/Space 0.075mm/ 0.075mm Warp&Twist ≤0.5%
Min.Annular Ring ≥0.125mm Aspect Ratio 8:01
Impedance Control ±8% Surface Finish HAL LF,ENIG,
Imm.Tin/Silver,OSP

Product Tags:

pcb copper sheet fr4

thermal conductivity of fr4 pcb

copper clad sheet for pcb
Inquiry Cart 0
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