Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

Manufacturer from China
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HAL FR4 Custom PCB Boards Blank Printed Circuit Boards For Washing Machine

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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HAL FR4 Custom PCB Boards Blank Printed Circuit Boards For Washing Machine

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Brand Name :XCE
Model Number :XCEC
Certification :CE,FCC,Rohs,ISO9001,SGS,UL
Place of Origin :China
MOQ :1PCS
Price :USD 1-500
Payment Terms :Western Union, L/C, T/T
Supply Ability :10000000pcs / per month
Packaging Details :inner vacuum package, outer carton box
Layer :4
Brand :XCE
Model :XCEC
Size :300*300mm
Panel :1*1
Color :green
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View Product Description

HAL FR4 Custom PCB Maker 30*30 CM Blank Circuit Boards For Washing Machine

Quick detail:

Base material: FR4
Board thickness: 1.6mm
Customized: YES
Copper thickness: 35UM
Min line space and width: 0.2MM


Our Advantage:
1. Our company can meet all your PCB manufacturing needs from single-sided to complex multi-layered PCB.
2. All orders receive and engineering file review before going to fabrication .
3. We have a consistent on-time shipping record and we are now shipping many of our orders early



Technology:

our products have passed UL, ISO9001 and IS014001 certifications.

NO

ITEM

Technical capabilities

1

Layers

1-30 layers

2

Max. Board size

2000×610mm

3

Min. board Thickness

2-layer 0.15mm

4-layer 0.38mm

6-layer 0.55mm

8-layer 0.80mm

10-layer 1.0mm

4

Min. line Width/Space

0.075mm(3mil)

5

Max. Copper thickness

6OZ

6

Min. S/M Pitch

0.075mm(3mil)

7

Min. hole size

0.1mm(4mil)

8

Hole dia. Tolerance (PTH)

±0.05mm(2mil)

9

Hole dia. Tolerance (NPTH)

+0/-0.05mm(2mil)

10

Hole position deviation

±0.05mm(2mil)

11

Outline tolerance

±0.10mm(4mil)

12

Twist & Bent

0.75%

13

Insulation Resistance

>1012Ω Normal

14

Electric strength

>1.3kv/mm

15

S/M abrasion

>6H

16

Thermal stress

288°C 20Sec

17

Test Voltage

50-300V

18

Min. blind/buried via

0.15mm (6mil)

19

Surface Finished

HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold

20

Materials

FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base





















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