Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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RFID Internal Embedded Dual-Band GSM Antennas RF PCB For WIFI 2.4GHZ Semiconductor
Quick Detail:
| Material: Rogers | Number of layer: 2 |
| Model: XCER | Brand: XCE |
| Name: RF high frequency PCB | Origin: shenzhen |
Parameter:
| Board thickness | 0.21mm to 7.0mm |
| Copper thickness | 0.5 OZ to 7.0 OZ |
| Copper thickness in hole | >25.0 um (>1mil) |
|
Size | Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) | |
| Min. Line Width: 3mil (0.075mm) | |
| Min. Line Spacing: 3mil (0.075mm) | |
|
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
| Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
| Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. | |
Application
PCBs are applied to a wide range of High-tech industries such as: telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
Advantages:
1) We have professional research team.
2) No MOQ,small order are aslo welcome,From Prototype to Mass production.
3) All products are 100% tested working before sent to you.
4) One stop PCB solution
5) We have professional sales team, so please do not hesitate to contact us if you have any question
Description
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
