Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Quick Details
Model Number: XCER
Number of Layers: 2-Layer
Base Material: Risho
Copper Thickness: Inner 1/2 oz-4oz;Outer 1oz-5oz
Board Thickness: 0.8mm
Min. Hole Size: 0.2mm-6.3mm
Min. Line Width: 3MIL
Min. Line Spacing: 3mil
Surface Finishing: Immersion
Color: Green
Service: One-stop Service
Certificate: ISO9001,SGS,UL
Name: High frequency pcb
Testing Service: standard
Type: Panel
Shipping: Buyer's Requirement
PCB Introduction
1, Surface finish: Immersion Gold/HALS/OSP/Gold finger/Carbon print/Peelable mask/Blue mask/Plating gold
2, Solder mask colour: green/white/yellow/blue/red/black
3, Silk screen: white/black/yellow/red/blue/green
4, Applied in industrial facilities/medical facilities/consumer electronics/telecommunications/power supply
Technology parameter:
| Layer | 2 layer |
| Material type | Risho |
| Board thickness | 0.8mm |
| Copper thickness | 0.5OZ |
| Copper thickness in hole | >25.0 um (>1mil) |
| | Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) | |
| Min. Line Width: 3mil (0.075mm) | |
| Min. Line Spacing: 3mil (0.075mm) | |
| | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| | Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
| Any other special material please feel free to let us know | |
PCB Technical Specification
