Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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2.4mm Rigid Polyimide PCB 4 Layer Shengyi SH260 Circuit Board Maker
Specification:
• Polyimidemprodesu-highennalperfonnanwith
Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
• Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
• Maini mechani 1 strength and bonding sngth at high temperature.
• Tough resin systemNon-MOAemist
• Haelfrree chemistry mpatible withe1 pro sslng.
RoHSJWEEE mpliant.
• IPC4101D.0/41
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• Polyimidemprodesu-highennalperfonnanwith
Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
• Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
• Maini mechani 1 strength and bonding sngth at high temperature.
• Tough resin systemNon-MOAemist
• Haelfrree chemistry mpatible withe1 pro sslng.
RoHSJWEEE mpliant.
• IPC4101D.0/41
