Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Frequency High 180 TG Multilayer Rogers Rt/duriod 5880 PCB Used In Military Radar Systems
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size : 12*4cm
5. Permittivity : 3
6. Surface finish : Gold Plating
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .
Description :
RT/duroid® 5880 high frequency laminates are PTFE composites reinforced with glass microfibers.The randomly oriented microfibers result in exceptional dielectric constant uniformity.
The dielectric constant of these high frequency laminates is the lowest of all products, and low dielectric loss make them well suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of its extremely low water absorption characteristics, RT/duroid 5880 laminates are ideal for applications in high moisture environments.
RT/duroid 5880 laminates are easily cut, sheared and machined to shape, and resistant to all solvents and reagents normally used in etching printed circuits or plating edges and holes. RT/duroid 5870 and 5880 laminates have the lowest electrical loss of any reinforced PTFE material, low moisture absorption, are isotropic, and have uniform electrical properties over frequency.
Typical Applications:
Rogers RT/duroid 5880 high frequency laminates are used in:
Production Description :
| XCE PCB technical specifications | ||
| Annual stock Material | Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free | |
| Layer No. | 1~16 | |
| Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
|
| Max panel size | 508*610mm | |
| Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% | |
| Wall hole copper thickness | >0.025mm(1mil) | |
| Finished hole | 0.2mm-6.3mm | |
| Min line width | 4mil/4mil(0.1/0.1mm) | |
| Min bonding pad space | 0.1mm(4mil) | |
| PTH aperture tolerance | ±0.075mm(3mil) | |
| NPTH aperture tolerance | ±0.05mm(2mil) | |
| Hole site deviation | ±0.05mm(2mil) | |
| Profile tolerance | ±0.10mm(4mil) | |
| Board bend&warp | ≤0.7% | |
| Insulation resistance | >1012Ωnormal | |
| Through-hole resistance | <300Ωnormal | |
| Electric strength | >1.3kv/mm | |
| Current breakdown | 10A | |
| Peel strength | 1.4N/mm | |
| Soldmask regidity | >6H | |
| Thermal stress | 288℃20Sec | |
| Testing voltage | 50-300V | |
| Min buried blind via | 0.2mm(8mil) | |
| Outer copper thickness | 1oz-5oz | |
| Inner cooper thickness | 1/2 oz-4oz | |
| Aspect ratio | 8:1 | |
| SMT min green oil width | 0.08mm | |
| Min green oil open window | 0.05mm | |
| Insulation layer thickless | 0.075mm-5mm | |
| Taphole aperture | 0.2mm-0.6mm | |
| Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB | |
| Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating | |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.