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Shenzhen Xinchenger Electronic Co.,Ltd

City:shenzhen

Province/State:guangdong

Country/Region:china

Contact Person:Mskaren

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China High Frequency Ultrasonic Generator PCB With UL Short Delivery Time wholesale

High Frequency Ultrasonic Generator PCB With UL Short Delivery Time

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Brand Name :XCE

Model Number :XCE BG6

Certification :CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin :China

MOQ :MOQ 1 Piece

Price :Negotiation

Payment Terms :T/T, Western Union

Supply Ability :1000000 pieces per week

Delivery Time :5-10 working days

Packaging Details :1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color :Green

Material :Rogers + FR4 Material

Layer :Multilayer

Board Size :9*9cm

Copper Thinknes :1 oz

Min Line Width :4 mil

Min Line Space :4mil

Surface Finish :Immersion Gold

Name :FR4 pcb

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High Frequency Ultrasonic Generator PCB With UL Short Delivery Time
Quick Detail :
1. Type : Pcb
2. Material : Fr4+Rogers
3. Layer : Multilayer
4. Products Size :9*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold

Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .

Description :
FR4 is a mid Dk Df 3.65 0.0096, resin systerm . FR4 delivers 30% improvement in z-axis expansion and off 25% more electrical bandwidth (low loss) than competitive products in this space

High Thermal Performance

Tg of 200 (DSC), 230°C (DMA)
Low CTE for reliability
Lead-free Compatible & Rhos Complaint
UV Blocking and AOI Fluorescence
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Key Benefits:

High dielectric constant for circuit size reduction
Low loss. Ideal for operating at X-band or below
Tight εr and thickness control for repeatable circuit performance

Typical Applications:

Space Saving Circuitry
Patch Antennas
Satellite Communications Systems
Power Amplifiers
Aircraft Collision Avoidance Systems
Ground Radar Warning Systems

Production Description :

Parameter	Value
Speciﬁc gravity/density	1.850 g/cm³ (3,118 lb/cu yd)
Water absorption	−0.125 in < 0.10%
Temperature index	140 °C (284 °F)
Thermal conductivity, through-plane	0.29 W/(m·K),^[1] 0.343 W/(m·K)^[2]
Thermal conductivity, in-plane	0.81 W/(m·K),^[1] 1.059 W/(m·K)^[2]
Rockwell hardness	110 M scale
Bond strength	> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW	> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW	> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW	> 310 MPa (45,000 psi)
Izod impact strength - LW	> 54 J/m (10 ft·lb/in)
Izod impact strength - CW	> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise	> 415 MPa (60,200 psi)
Dielectric breakdown (A)	> 50 kV
Dielectric breakdown (D48/50)	> 50 kV
Dielectric strength	20 MV/m
Relative permittivity (A)	4.8
Relative permittivity (D24/23)	4.8
Dissipation factor (A)	0.017
Dissipation factor (D24/23)	0.018
Dielectric constant permittivity	4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature	Can vary, but is over 120 °C
Young's modulus - LW	3.5×10⁶ psi (24 GPa)
Young's modulus - CW	3.0×10⁶ psi (21 GPa)
Coefficient of thermal expansion - x-axis	1.4×10⁻⁵ K⁻¹
Coefficient of thermal expansion - y-axis	1.2×10⁻⁵ K⁻¹
Coefficient of thermal expansion - z-axis	7.0×10⁻⁵ K⁻¹
Poisson's ratio - LW	0.136
Poisson's ratio - CW	0.118
LW sound speed	3602 m/s
SW sound speed	3369 m/s

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

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