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Shenzhen Xinchenger Electronic Co.,Ltd

City:shenzhen

Province/State:guangdong

Country/Region:china

Contact Person:Mskaren

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High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2

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Brand Name :XCE

Model Number :XCE BK45

Certification :CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin :China

MOQ :MOQ 1 Piece

Price :Negotiation

Payment Terms :T/T, Western Union

Supply Ability :1000000 pieces per week

Delivery Time :5-10 working days

Packaging Details :1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color :Yellow

Material :Rogers Material

Layer :4

Board Size :5*9cm

Copper Thinknes :1 oz

Min Line Width :4 mil

Min Line Space :4mil

Surface Finish :Immersion Gold

Name :Rogers pcb

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High performance 3206 Rogers PCB 0.635 mm Thinckness HF PCB ER =10.2

Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : 4
4. Products Size :5*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Gold

Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .

Parameter:

Model	Parameter	thickness(mm)	Permittivity(ER)
F4B	F4B	0.38	2.2
	F4B	0.55	2.23
	F4B	0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0	2.65
	F4Bk	0.8,1.5	2.65
	F4B	0.8	3.5
	FE=F4BM	1	2.2
Rogers	RO5880	0.254 0.508 0.762	2.20 ± 0.02
	RO4350	0.254 0.508,0.8,1.524	3.5
	RO4003	0.508	3.38
TACONIC	TLF-35	0.8	3.5
	TLA-6	0.254,0.8,1,1.5,	2.65
	TLX-8	0.254,0.8,1,1.6	2.55
	RF-60A	0.64	6.15
	TLY-5	0.254,0.508,0.8	2.2
	TLC-32	0.8,1.5,3	3.2
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2

Description :

RO3203™, RO3206™ and RO3210™ Laminates

RO3203™ , RO3206™ and RO3210™ high frequency circuit materials are ceramic- fi lled laminates reinforced with woven fi berglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200™ series high frequency materials were designed as an extension of the RO3000® series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability.

The dielectric constant of RO3203 high frequency circuit materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz. The dielectric constant for RO3206 laminate is 6.15 and 10.2 for RO3210 laminate. The dissipation factor for RO3206 and RO3210 laminates is 0.0027.

High Thermal Performance

Tg of 200 (DSC), 230°C (DMA)
Low CTE for reliability
Lead-free Compatible & Rhos Complaint
UV Blocking and AOI Fluorescence
Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat

PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Key Benefits:

High frequency performance (RO3203™ laminate) can be used in applications exceeding 20 GHz
Suitable for use with epoxy multi-layer board hybrid designs
Surface smoothness allows for finer line etching tolerances

Typical Applications:

High frequency performance (RO3203™ laminate) can be used in applications exceeding 20 GHz
Suitable for use with epoxy multi-layer board hybrid designs
Surface smoothness allows for finer line etching tolerances
Typical Applications
Automotive collision avoidance systems
Automotive global positions satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

Production Description :

Parameter	Value
Speciﬁc gravity/density	1.850 g/cm³ (3,118 lb/cu yd)
Water absorption	−0.125 in < 0.10%
Temperature index	140 °C (284 °F)
Thermal conductivity, through-plane	0.29 W/(m·K),^[1] 0.343 W/(m·K)^[2]
Thermal conductivity, in-plane	0.81 W/(m·K),^[1] 1.059 W/(m·K)^[2]
Rockwell hardness	110 M scale
Bond strength	> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW	> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW	> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW	> 310 MPa (45,000 psi)
Izod impact strength - LW	> 54 J/m (10 ft·lb/in)
Izod impact strength - CW	> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise	> 415 MPa (60,200 psi)
Dielectric breakdown (A)	> 50 kV
Dielectric breakdown (D48/50)	> 50 kV
Dielectric strength	20 MV/m
Relative permittivity (A)	4.8
Relative permittivity (D24/23)	4.8
Dissipation factor (A)	0.017
Dissipation factor (D24/23)	0.018
Dielectric constant permittivity	4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature	Can vary, but is over 120 °C
Young's modulus - LW	3.5×10⁶ psi (24 GPa)
Young's modulus - CW	3.0×10⁶ psi (21 GPa)
Coefficient of thermal expansion - x-axis	1.4×10⁻⁵ K⁻¹
Coefficient of thermal expansion - y-axis	1.2×10⁻⁵ K⁻¹
Coefficient of thermal expansion - z-axis	7.0×10⁻⁵ K⁻¹
Poisson's ratio - LW	0.136
Poisson's ratio - CW	0.118
LW sound speed	3602 m/s
SW sound speed	3369 m/s

Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

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