Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High Frequency Isola FR408 Pcb With High TG Blind And Buried Vias Carbon Print
Products Details
| Raw Material | Rogers |
| Layer Count | Multilayer |
| Board Thickness | 0.5 mm |
| Copper Thickness | 0.5 oz |
| Surface Finish | Immersion Silver |
| Solder Mask | Green |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 560*400mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PCB Capability
| Layer | 1-30L |
| Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb . |
| Board Thinckness | 0.2-6mm |
| Max Finish Size | 800*508mm |
| Min. Drill Hole Size | 0.25mm |
| Min. Line Width | 0.075mm(3mil) |
| Min. Line Spacing | 0.075mm(3mil) |
| Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
| Copper thickness | 0.5-4.0 Oz |
| Solder mask color | green/black/white/red/blue/yellow |
| Inner packing | Vacuum packing, Plastic Bag |
| Outer packing | standard carton packing |
| Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| Certificate | ISO9001,SGS |
| Profiling punching | Routing,V-CUT,Beveling |
Parameter:
Isola FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.
Its low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques
This is the standard laminate used in our sector of the industry. We carry stocks of all the main variants. The standard thickness used is 1.6mm, but we also stock 0.8mm, 1.0mm, 1.2mm, 2.0mm, 2.4mm, and 3.2mm. The most common copper thickness is 35 microns or 1oz square foot but 70 microns 2 oz square Ft is regularly used for higher current applications.
Its closely related to FR5 which is the old high temperature version, but has now been replaced by the more common BT Epoxy type.
PrePreg Material
| Parameter | Value |
| Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption | −0.125 in < 0.10% |
| Temperature index | 140 °C (284 °F) |
| Thermal conductivity, through-plane | 0.29 W/(m·K), 0.343 W/(m·K) |
| Thermal conductivity, in-plane | 0.81 W/(m·K), 1.059 W/(m·K) |
| Rockwell hardness | 110 M scale |
| Bond strength | > 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) |
| Izod impact strength - LW | > 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW | > 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise | > 415 MPa (60,200 psi) |
| Dielectric breakdown (A) | > 50 kV |
| Dielectric breakdown (D48/50) | > 50 kV |
| Dielectric strength | 20 MV/m |
| Relative permittivity (A) | 4.8 |
| Relative permittivity (D24/23) | 4.8 |
| Dissipation factor (A) | 0.017 |
| Dissipation factor (D24/23) | 0.018 |
| Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature | Can vary, but is over 120 °C |
| Young's modulus - LW | 3.5×106 psi (24 GPa) |
| Young's modulus - CW | 3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 |
| Poisson's ratio - LW | 0.136 |
| Poisson's ratio - CW | 0.118 |
| LW sound speed | 3602 m/s |
| SW sound speed | 3369 m/s |
| LW Acoustic impedance | 6.64 MRayl |
Compared Data :
| Model | ER | Tanδ@ 1GHz | Cter (ppm/℃) |
CTE (X,Y) (ppm/℃) |
|
| FR4 | Normal | 4.6 | 0.030 | 17 | |
| FR4 | PCL370(FR4-HTG) | 4.3 | 0.0015 | 51 | 17 |
| FR4 | 117 (FR4-HTG) | 4.4 | 0.013 | 17 | |
| Park Neclo | N4000-6-FC BC (FR4-HTG) | 4.1 | 0.0015 | 16 |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.