Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Telephone Fr4 PCB Boards In Panel Size With Process Edge / 1.6mm 2 layer pcb Board
Quick detail:
| Origin:China | Special: FR4 Material |
| Layer:2 | Thickness:1.6mm |
| Surface: HASL-LF | Hole:0.5 |
To assist in the production process side is the plug go board, peak in the welding on both sides or four sides of the PCB part of the increase, mainly to assist production, not part of the PCB board, the production is completed to be removed.
Model Number:XCEPCB006
Shipping port:ShenZhen/HongKong
Place of origin:GuangDong,China
Delivery Time:3-10 Working Days
Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms
Price Terms:FOB
Minimum Order Quantity:1pc
Payment terms:TT,Paypal,Western Union
Certification:CE,ROHS,FCC,ISO9008,SGS,UL
Advantage
Multilayer rogers pcb printed circuit board
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
Multilayer pcb circuit boards :4Layer -36 layer
We can supply:
Rogers High Frequency Laminate/Material
High frequency pcb manufacture
PCB assembly
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
| Brand | Model | Thickness(mm) | DK(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
| RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
| RO5880 | 0.254.0.508.0.762 | 2.2 | |
| RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
| RO3010 | 0.635 | 10.2 | |
| RO3206 | 0.635MM | 10.2 | |
| R03035 | 0.508MM | 3.5 | |
| RO6010 | 0.635MM, 1,27MM | 10.2 |