Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Blue Soldermask multi layer pcb Board , Min Line Width 4Mil Electronic printed circuit board

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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Blue Soldermask multi layer pcb Board , Min Line Width 4Mil Electronic printed circuit board

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Brand Name :XCE
Model Number :XCEM
Certification :CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Material :Rogers
Layer :6
Color :Green
Min line space :4mil
Min line width :4mil
Copper thickness :1OZ
Board size :79*99mm
Panel :1
Surface :ENIG
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Blue Soldermask multi layer pcb Board , Min Line Width 4Mil Electronic printed circuit board




Typical Applications:

6 Layer Blue Soldermask High Frequency PCB Board Min Line Width 4Mil Electronic Board


Antenna Radio FM Rogers 3003 High Frequency PCB With Half Hole In 0.79mm Thickness

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes
  • LMDS and wireless broadband
  • Base station infrastructure



Advantage

6 Layer Blue Soldermask High Frequency PCB Board Min Line Width 4Mil Electronic Board

The basic characteristics of high-frequency substrate material requirements are the following:
(1) the dielectric constant (Dk) must be small and very stable, usually the smaller the better the signal transmission rate and the dielectric constant
Of the square root is inversely proportional to high dielectric constant likely to cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling



Rogers material in stock:

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

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