Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Customed 1.6mm Electronics Pcb Double Sided Ul 94v0 Black Soldermask White Silkscreen
Quick detail:
| Origin:China | Special: FR4 Material |
| Layer:2 | Thickness:1.6mm |
| Surface: ENIG | Hole:0.5 |
Specification:
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
Typical Application
Double Layers PCB consist of two copper layer on a rigid base material, the two copper layers are not connected . Double sided pcb’s with plated through holes have two copper layers that can be connected by a copper plated hole , solder resist and idents can also be added. Double sides PCB are a step above single sided in their complexity. Double Sided PCBs require plated through holes to provide better anchoring for soldered components and front to back electrical continuity. Double Sided circuit boards were the gateway to higher technology applications.We offer a wide range of Double Sided PTH PCB board which is known for its excellent performance and user friendliness for you .This type of pcb can be used for both through hole and surface mount components.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Products specification:
Layers: 2
Material /Laminate: FR4
Board thickness: 1.6mm
Copper weight: 1/1oz
Finishing: ENIG
We provide our customers the quick turn service
● 2layers—24hours urgent
● 4layers—48hours urgent
● 6layers —72hours urgent
● 8layers—96hours urgent
● 10layers —96hours urgent
Please feel free to contact us when you have any urgent projects.
Contact:sales3@xcepcb.com
Skype:karen-xcepcb.com