Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Customized Rogers 4350 High TG170 pcb printed circuit board RF Application 1oz Copper
Quick detail:
| Origin:China | Special: High frequency pcb |
| Layer:4 | Thickness:0.508mm |
| Surface: ENIG | Hole:0.2 |
Basic Info
Model NO.: XCEPCB002
Dielectric: Rogers
Application: RF Remote Control Transmitter
Mechanical Rigid: Rigid
Base Material: Copper
Brand: XCE
Thickness: 0.508mm
Surface: Enig
Trademark: XCE
Specification: UL(US&Canada). ISO. RoHs, TS, SGS
HS Code: 8534009000
Type: Rigid Circuit Board
Flame Retardant Properties: V0
Layer: 4
Trace: 0.125mm
Soldmask: Green
Transport Package: Vacuum Package
Origin: Shenzhen, China
Typical Applications:
Features:
Rogers pcb multilayer pcb with high frequency can improvide the products quality ,
with high techolonogy treatment improve the life cycle of the products .
The high frequency rogers pcb with 4 mil 1 oz ,also with DHI half hole blind buried techonology .
Immersion gold surface finish make the pcb 's conductive performance enhancements.
Multilayer pcb design ,the precision of the pcb improves much more better .
Low dielectric : 3 dielectric conductivity much more precision .Rogers material used in RF Microwave fields in radar system .
Specifiction:
layer:4
board thickness:0.508mm
Copper thickness:1oz
min Hole size:0.2mm
min line width and distance:10/10mil
Surface treatment: imersion gold
Application: RF Remote Control Transmitter
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb