Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Rogers RO4003 Copper Based pcb multilayer fabrication ISO RoHS 0.79mm Thickness

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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Rogers RO4003 Copper Based pcb multilayer fabrication ISO RoHS 0.79mm Thickness

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Brand Name :XCE
Model Number :XCEM
Certification :CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Material :Rogers
Layer :14
Color :Green
Min line space :5mil
Min line width :5mil
Copper thickness :2OZ
Board size :51*200mm
Panel :1
Surface :ENIG
Other :Impedance Control
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Rogers RO4003 Copper Based pcb multilayer fabrication ISO RoHS 0.79mm Thickness

Quick detail:
Basic Info
Model NO.: XCEPCB005
Dielectric: Rogers
Application:RF Module
Mechanical Rigid: Rigid
Base Material: Copper
Brand: XCE
Thickness: 0.79mm
Surface: Enig
Trademark: XCE
Specification: UL(US&Canada). ISO. RoHs, TS, SGS
HS Code: 8534009000
Type: Rigid Circuit Board
Flame Retardant Properties: V0
Layer: 14
Trace: 0.125mm
Soldmask: Green
Transport Package: Vacuum Package
Origin: Shenzhen, China

Product Description
L1-L2 Blind holes;
L2-L3 Bury holes;
L1-L4 Through holes;
Copper based with Rogers 4003 T1.3mm.
Copper thickness 0.70mm;
Milling thickness 1.2mm.


Available substrates:
RO4350B RO4003C TLX-8 (TACONIC) F4B Woven Glass-Reinforced PTFE
4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm)
10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm)
13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm)
20mil (0.508mm) 32mil(0.813mm)
30mil(0.762mm) 60mil(1.524mm)
60mil(1.524mm)

Applications:
Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
WiMAX, LTE bands 3G and 4G antenna

Typical Applications:

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes
  • LMDS and wireless broadband
  • Base station infrastructure



Features:
Rogers pcb multilayer pcb with high frequency can improvide the products quality ,
with high techolonogy treatment improve the life cycle of the products .
The high frequency rogers pcb with 4 mil 1 oz ,also with DHI half hole blind buried techonology .
Immersion gold surface finish make the pcb 's conductive performance enhancements.
Multilayer pcb design ,the precision of the pcb improves much more better .
Low dielectric : 3 dielectric conductivity much more precision .Rogers material used in RF Microwave fields in radar system .

Specifiction:
layer:14
board thickness:0.79mm
Copper thickness:1oz
min Hole size:0.2mm
min line width and distance:10/10mil
Surface treatment: imersion gold
Application: RF Module

Xinchenger Electronics co.,Ltd established in 2002,
we have commited ourselves to manufacturing various of hi-frequency microwave pcb
and multi-layer board including fastest sample production.

we have accumulated abandunt experiences in the line of high frequency microwave business
for which widely apply to power divider,combiner,power amplifier,
line amplifier,base station,RF antena,4G antena so on and so forth.
our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,
TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,
Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,
we also keen on helping customers shorten the period of production development
and 24 hours of sample service is available.

Since the day of company foundation we continuously enaged in researching special
and high precision printed circuit boards
with the strong production capability of 2 to 28 layers of highly precise impedence,
multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.
we emphasize the significance of traning program for every single staff in the company
even grass-roots employees which becomes the most competitive factors to excel from others,
our company have many experienced and professional teams from management to production line,
30% are highly educated among the total amount of employees,
advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field
which lead our experienced hi-frequencey researching team to one step ahead of
the line of printed circuit board business,
we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,
prompt delivery,satisfied after sales service for may years and we assure our customers that we will return
the favors with more and more superior products in the near future.

Company spirit:Customer first,openness basing on sincerity.

Comapny culture:Improve employees quality with on the job training.

Quality policy:Honesty,superior quality,high efficiency.

Company tenet: Provide customers with satisfactory products and service is our eternal tenet.

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling


Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb

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