Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface
Key specifications:
Material: Rogers
Layer: 4 Layer
Copper thickness: 1oz
Surface finish: Immersion Gold
Size:199*59mm
Buried and blind hole: no
Application: gas detector, remote control, telecommunication products
Reference - our production capability for rigid PCB:
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR4,Rogers,Taconic
Max. finished board size: 23 x 25 (580 x 900mm)
Min. drilled hole size: 3mil (0.075mm)
Min. line width: 3mil (0.075mm)
Min. line spacing: 3mil (0.075mm)
Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
Immersion Silver/gold,OSP, gold plating
Copper thickness: 0.5-7.0oZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0µm (>1mil)
Inner packing: Vacuum packing/plastic bag
Outer packing: Standard carton packing
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
Special requirements: buried and blind Vias + controlled impedance + BGA
Profiling: Punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
Main Export Markets:
Eastern Europe
North America
Mid East/Africa
Western Europe
Asia
Central/South America
Primary Competitive Advantages:
Experienced Staff
Green Product
Packaging
Price
Prompt Delivery
Quality Approvals
Small Orders Accepted
Parameter:
o Item Data
1 Layer: 1 to 24 layers
2 Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness:0.20mm to 3.4mm
4 Copper thickness:0.5 OZ to 4 OZ
5 Copper thickness in hole:>25.0 um (>1mil)
6 Max. Board Size:(580mm×1200mm)
7 Min. Drilled Hole Size:4mil(0.1mm)
8 Min. Line Width:3mil (0.075mm)
9 Min. Line Spacing:3mil (0.075mm)
10 Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:±0.13
13 Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14 Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate:UL,SGS,ISO 9001:2008
16 Special requirements:Buried and blind vias+controlled impedance +BGA
17 Profiling:Punching, Routing, V-CUT, Beveling
Applications:
Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
WiMAX, LTE bands 3G and 4G antenna
Typical Applications:
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb