Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Electrical 6 Layer PCB Printed Circuit Board Green Solder PCB Board

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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Electrical 6 Layer PCB Printed Circuit Board Green Solder PCB Board

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Brand Name :XCE
Model Number :XCEM
Certification :CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Material :FR4
Layer :6
Color :Green
Min line space :4mil
Min line width :4mil
Copper thickness :1OZ
Board size :88*68MM
Panel :1
Surface :Immersion Gold
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Electrical 6 Layer PCB Printed Circuit Board for Equipments Impedance Control Green Solder PCB

Description:

We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.

F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material

FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.

specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger

About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )

Parameter:

Product name FR4 PCB Double side 4 layer 6 layer 8 layer 10-28layer
layer Single side Double side 4 layer 6 layer 8 layer 10-28layer
Base Maerial FR4 FR4,Alu,polymide FR4 FR4 FR4 FR4
Copper thickness 1-6OZ
Min.Hole size 0.1mm
Min.Line Width 0.1mm
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color green,red,black,white,yellow
Silkscreen color black,white,yellow
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA

Factory Manufacture Capability
NO ITEM Techinical capabilities
1 Materials FR-4,Rogers,Taconic,Isola,F4B,Nelco
2 Material Type Rogers,Taconic,Isola,F4B,Nelco
3 Layers 1-multi Layer
4 Min. core material PP
5 Max. board size 600mm *1200mm
6 Copper Thickness 1-4 OZ
7 Min. board thickness 0.5 mm
8 Max. board thickness 5.0 mm
9 Min. line width/space 0.1mm
10 Min. Letter line width 0.15mm
11 Min. Letter height 0.8mm
12 Min. hole size 0.75mm(NPTH)
13 Hole dia. tolerance ±0.05mm
14 solder Mask White, Black, Green
15 Outline Tolerance ±0.15mm
16 Modeling Punching, Routing, V-cutting
17 Special Hole Blind hole, Blind slot, T-hole, T-slot, Counter sink hole, Cup hole
18 Peel Strength >=1.3N/mm
19 Thermal Stress 288ºC, 2min
20 Thermal Conductivity >=2.0 W/m-k
21 Thermal Resistance ≤0.55 ºC/W
22 Test Voltage 5 V
23 Surface Finish HAL , OSP , Immersion Gold
24 File Format Gerber , DPF, HPGL,CAM,DXP,CADM,PADS
25 Dielectric Breakdown >=2.5 KV
26 Max. Package Size 1200mm*600 mm
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