Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Rogers4003 Microwave PCB With Copper Burried/Blind Hole, Vias, Printed Circuit Board
Key specifications/special features:
Rogers PCB
Rogers 4350B, Roger3003, Rogers4003,Roger 5880 and more material on stock
PCB thickness: 0.2-2mm+/-10%
Final copper: 0.5-10oz
Min hole: 0.2mm
Min line width/space: 4/4mil
Min hole copper: 20μm/25μm
Solder mask: green/blue/red/black/gray/white
Legend: white/black/yellow
Surface: OSP/HAL lead-free/immersion gold/immersion tin/
immersion silver/flash gold/hard gold
Outline: rout and score/V-cut
E-test: 100%
Certificates: UL, SGS, RoHS Directive-compliant, ISO
Files: Gerber Protel DXP Auto CAD PADs eagle
Testing: flying probe test, E-test, X-ray Inspection, AOI
RO4003 (r = 3.38) and RO4350 (r = 3.48) is the same material for the commercial market development. Woven fiberglass body is immersed in a ceramic plus thermoplastic resin to form a rigid and temperature stable laminate, electrical characteristics suitable for microwave frequencies. Mechanical properties of this material is similar to FR4, can use ordinary FR4 production processing technology, in combination with prepreg RO4403, can make plywood. RO4350 material for the needs UL94V0 grade applications. Compared with the price RO3000 series, RO4000 low-cost microwave circuit applications selective superior.
Rogers4003 Microwave PCB With Copper Burried/Blind Hole, Vias, Printed Circuit Board specialties:
PCB types: Rigid PCB/high frequency PCB/high TG PCB and more
PCB materials:Rogers/Taconic/F4B/Arlon and more
PCB finish: HAL/LFHAL/ENIG/immersion tin/OSP/immersion silver/flash gold/gold plated and more
PCB application: Satellite transceiver, Microwave sensors, RF transceiver,RF Transmitter,radar motion module,Microwave Sensor module,radar motion detector module,microwave source module,RF synthesizer modules,RF Power Amplifiers and more
Which widely be used for :
Automotive Antennas / RFID
Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability
Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C,RO4350B,RO4360,RO4533,RO4535,RO4730,
RO4232,RO4233,RO3003,RO3006,RO3010,RO3035,RO3203,RO3206,
RO3210,RO3730,RO5780,RO5880,RO6002,RO3202,RO6006,
Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
High frequency:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Rogers4003 Microwave PCB With Copper Burried/Blind Hole, Vias, Printed Circuit Board,
Xinchenger Electronics Customer Service:
1.Xinchenger provide PCB fabrication, PCB assembly, Components and Stencil.
2. PCB Assembly with SMT Technology, Turnkey Projects and Die Bonding Process, Lead-free.
3. We have the end-to-end WIP online order tracking system which managers every aspect of your products, this ensures our quality manufacturing process for timely delivery.
4. We can accept CAM350, GC - CAM, GERBER PROTEL 99SE, EAGLE, CAM drawing for producing PCBs.
5. Reliability Test: Flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micor metallographic section analysis, etc.