Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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| Product Name | Ultrasonic Humidifier Circuit Board |
| Type | Multilayer PCB |
| Material | FR4, CEM1, CEM3, High Frequency Board, |
| Layer | 1,2,4,6...28Layer |
| Shape | Retangular, Round, Slots, Cutouts, Complex, Irregular |
| Cutting | Shear, V-score, Tab-routed |
| Board Thickness | 0.2-4mm, regular 1.6mm |
| Copper Thickness | 0.5-4oz, regular 1oz |
| Solder Mask | Green, Red, Blue, Yellow, etc. |
| Silk Screen | White, Black, etc. |
| Silk Screen Min Line Width | 0.006" or 0.15mm |
| Min Trace/Gap | 0.1mm or 4mils |
| Min Drill Hole Diameter | 0.01",0.25mm or 10mils |
| Surface Finish | HASL, ENIG, OSP, etc. |
RF and Antenna Design
Capabilities
Custom and Commercial Communication Systems
Complete Wireless System Architecture and Design
Miniature RF Design
Baseband Design
Wireless Firmware
Concept to Production
High and Low Volumes