Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear transponder
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Specification:
| Brand: XCE |
| Model: XCEH |
| Board size: 9*19cm |
| Cu thickness: 35UM |
| Material: High Frequency Material |
| Min line space&width: 4Mil |
Advantage
5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear transponder
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
Parameter
| XCE PCB technical specifications | |
| Material | High Frequency PCB |
| Layer No. | 2 |
| Min board thickness | 2 layer0.2mm |
| Max panel size | 508*610mm |
| Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% |
| Wall hole copper thickness | >0.025mm(1mil) |
| Finished hole | 0.2mm-6.3mm |
| Min line width | 4mil/4mil(0.1/0.1mm) |
| Min bonding pad space | 0.1mm(4mil) |
| PTH aperture tolerance | ±0.075mm(3mil) |
| NPTH aperture tolerance | ±0.05mm(2mil) |
| Hole site deviation | ±0.05mm(2mil) |
| Profile tolerance | ±0.10mm(4mil) |
| Board bend&warp | ≤0.7% |
| Insulation resistance | >1012Ωnormal |
| Through-hole resistance | <300Ωnormal |
| Electric strength | >1.3kv/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldmask regidity | >6H |
| Thermal stress | 288℃20Sec |
| Testing voltage | 50-300V |
| Min buried blind via | 0.2mm(8mil) |
| Outer copper thickness | 1oz-5oz |
| Inner cooper thickness | 1/2 oz-4oz |
| Aspect ratio | 8:1 |
| SMT min green oil width | 0.08mm |
| Min green oil open window | 0.05mm |
| Insulation layer thickless | 0.075mm-5mm |
| Taphole aperture | 0.2mm-0.6mm |
| Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB |
| Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, |
Description :
RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.
Description :
RT/duroid 5880 high frequency laminates are PTFE composites reinforced with glass microfibers.The randomly oriented microfibers result in exceptional dielectric constant uniformity.
The dielectric constant of these high frequency laminates is the lowest of all products, and low dielectric loss make them well suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of its extremely low water absorption characteristics, RT/duroid 5880 laminates are ideal for applications in high moisture environments.
RT/duroid 5880 laminates are easily cut, sheared and machined to shape, and resistant to all solvents and reagents normally used in etching printed circuits or plating edges and holes. RT/duroid 5870 and 5880 laminates have the lowest electrical loss of any reinforced PTFE material, low moisture absorption, are isotropic, and have uniform electrical properties over frequency.
Description :
RT/duroid 6002 microwave materials are a low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
The thermal coefficient of dielectric constant is extremely low from -55oC to+150oC (-67°F to 302°F) which provides the designers of filters, oscillators and delay lines the electrical stability needed in demanding applications.
Description :
RT/duroid 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2.
RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
RO3200 series material RO3203 (r = 3.02) and RO3210 (r = 10.2) two composition, suitable for application RO3000 series material but need better mechanical strength of the occasion. RO3200 series material is a combination of PTFE / ceramic with PTFE / woven fiberglass laminated, with good rigidity and RO3000 materials, the material in this series can also be produced with mixed FR4 multilayer MLB
Description :
RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.