Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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High Frequency PCB Board 4 Layer 1.6mm Thickness With 1OZ Copper Weight

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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High Frequency PCB Board 4 Layer 1.6mm Thickness With 1OZ Copper Weight

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Brand Name :XCE
Model Number :XCEC
Certification :CE,FCC,Rohs,ISO9001,SGS,UL
Place of Origin :China
MOQ :1PCS
Price :USD 1-500
Payment Terms :Western Union, L/C, T/T
Supply Ability :10000000pcs / per month
Packaging Details :inner vacuum package, outer carton box
Color :Green
Layer :4
Board size :6*8cm
Board THK :1.6mm
Cu THK :35UM
Panel Size :3*1
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High Frequency PCB Board 4 Layer 1.6mm Thickness With 1OZ Copper Weight

Specification:

Base Material: Rogers 4003C
Layer:4
Thickness: 1.6MM
Copper weight:1OZ
Surface finish: Immersion gold

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

Parameter:

Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
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