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Consumer Electronics Custom PCB Boards Fabrication With UL Rohs Certificate
Quick detail:
Origin:China | Special: |
Layer:4 | Thickness:1.2mm |
Surface: hasl | Hole:0.8 |
Specification:
RO4350B™ materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.
Typical Applications
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |