Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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4 Layer Circuit Boards High TG PCB High Thermal Conductivity Specification
Testing Procedures For PCB Board:
We perform multiple quality assuring procedures before shipping out any PCB board.
These include:
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)
Quotation Requirement :
a) Base material
b) Board thickness
c) Copper thickness
d) Surface treatment
e) color of solder mask and silkscreen
f) Quantity
Our Manufacturing Capability
| Item | Capability | Item | Capability |
| Layer | 1-12L | Min.Finished Hole | 0.1mm |
| Board Thickness | 0.3-3.2mm | PTH/NPTH Tolerance | ±0.076mm ±0.05mm |
| Laminate Type | FR-4 Halogen free High TG | Hole Cu.Thickness | ≥25μm |
| Laminate Brand | Shengyi,Nanya | Min.Dielectrical Thickness | 0.0635mm |
| CuFoil Thickness | 1/2 - 4oz | Layer Misregistration | ±0.076mm |
| Peel Strength | ≥12.3 N/cm | Min.Solder Mask Dam | 0.05mm |
| Max.Panel Size | 600mm * 700mm | Min.Legend Width | 0.10mm |
| Min.Line Width/Space | 0.075mm/ 0.075mm | Warp&Twist | ≤0.5% |
| Min.Annular Ring | ≥0.125mm | Aspect Ratio | 8:01 |
| Impedance Control | ±8% | Surface Finish | HAL LF,ENIG, |
| Imm.Tin/Silver,OSP |