Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness

Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness

Quick detail:

Specification:

heavy copper PCB board

Model Number:XCEPCB0023

Shipping port:ShenZhen/HongKong

Place of origin:GuangDong,China

Delivery Time:3-10 Working Days

Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union

Certification:CE,ROHS,FCC,ISO9008,SGS,UL

Specification:

Hi-Speed & Hi-Density Design Immersion Gold PCB,High Tg represents: a high heat resistance. Usually high Tg of 130 degrees or more plates, excellent high Tg is generally greater than 170 degrees, moderate Tg greater than about 150 degrees, PCB boards normally Tg≥170 ℃, called high Tg PCB. With the rapid development of the electronics industry, especially in the computer as the representative of electronic products toward high performance, high multi-layered development requires a higher heat resistance as an important guarantee of PCB substrate material. The emergence and development of SMT, CMT, represented by high-density mounting technology, the PCB in a small aperture, fine lines, thin side, high heat resistance become increasingly dependent on the substrate support

Typical Applications

Hi-Speed & Hi-Density Design Immersion Gold PCB

• Cellular Base Station Antennas and Power Amplifiers
• Microwave point to point (P2P) links
• Automotive Radar and Sensors
• low dielectric loss
• RF Identification (RFID) Tags
• The stability of the dielectric constant
• An extremely low water imbibition
• LNB’s for Direct Broadcast Satellites

Tg of the substrate is increased, PCB thermal resistance, moisture resistance, chemical resistance, stability and other characteristics will improve and improve. TG higher the value, the better the sheet temperature resistance, especially in the lead-free process, the high Tg applications more

Parameter:

Features

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

Rogers material in stock: