Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole

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Solder Mask Prototype multilayer pcb fabrication HDI PCB High TG 12 Layer

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Shenzhen Xinchenger Electronic Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:Mskaren
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Solder Mask Prototype multilayer pcb fabrication HDI PCB High TG 12 Layer

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Brand Name :XCE
Model Number :XCEM
Certification :CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin :China
MOQ :1pcs
Price :negotiation
Payment Terms :T/T,Western union
Supply Ability :1, 000, 000 PCS / week
Delivery Time :5-10 days
Packaging Details :inner: vacuum-packed bubble bag outer: carton box
Layer of number :12
Surface finish :Immersion gold
Base material :FR4
Size :9*7cm
Board THK :1.6mm
Product name :multilayer pcb
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Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material 12 Layer

1)Professional engineer team --help you to check design and do engineering before production

2)Rich expierences in pcb production industry--provide high quality and competitive price pcb.

3) After-sales service--every problem you have will get our professional advice and solution.

4) Constant follow up-- make us have the fast reaction of your requirement.

5) Inspected by the Inspection Institution--ISO,UL,ROHS cerfiticated

Specification:

Model XCEM
Layer 10
Brand XCE
Board THK 1.6MM
Surface finish Immersion gold
Size 160*120mm
Copper THK 1.5oz
Origin Shenzhen

Parameter:

No. of Layer

Up to 40 layers

Material

FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg

RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers

CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base

Min. Width/Spacing

50um/50um

Copper Thickness

1/3~12oz (12~420um)

Thickness

0.1~6.0mm (0.004’’~0.240’’)

Min. Hole Spacing

PTH (Plated Through Hole)

0.10mm (0.004’’)

NPTH (Non Plated Through Hole)

0.10mm (0.004’’)

Surface Finish

HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver

Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.

Special Processing Board

Copper plate edge, Sink hole, Tear ink, FPC

Description:

we have accumulated abandunt experiences in the line of high frequency microwave business for

which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,

4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as

Rogers,

TACONIC,Arlon,Isola,F4B,TP2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies

like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers

with high quality.furthermore,we also keen on helping customers shorten the period of production

development and 24 hours of sample service is available.

Why choose us:

15 years experience in PCB manufacturing

ISO9001, TS16949, UL Approval and RoHS compliant

One stop solution for PCB design, quick-turn prototyping, components sourcing, SMT & Through-hole assembly, Functional testing, Enclosure assembly.

Full Range of Testing Services: Visual and AOI Inspection, In Circuit Testing, X-Ray for BGA and Functional Testing.

Small to medium volume to production level quantities.

NDA (NON-DISCLOSURE AGREEMENT) is provided to sign for the confidentiality of your design

Solder Mask Prototype multilayer pcb fabrication HDI PCB High TG 12 Layer

Solder Mask Prototype multilayer pcb fabrication HDI PCB High TG 12 Layer

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